SiCarrier disclosed its roadmap at SEMICON China, revealing plans for ASML-compatible lithography machines by 2026. The company emphasizes compatibility with domestic fabs and anticipates initial commercial orders by Q4 2025. Backed by experienced leadership and partnerships with major foundries, SiCarrier aims to expand its global presence and R&D capabilities in the coming years.
SiCarrier made a significant impact at SEMICON China by unveiling pivotal details of its product roadmap. The Chinese chip equipment manufacturer has developed lithography machines designed for 300-mm wafers utilizing 28nm processes, with plans to introduce an upgraded version compatible with ASML and Applied Materials by 2026, as reported by anue.
According to Zhao Min, SiCarrier’s Market Director, the firm is dedicated to ensuring its equipment’s full compatibility with existing systems used by domestic fabricators. As stated by Chen Dong, the company’s CTO, SiCarrier has formed partnerships with several fabs to establish joint laboratories, anticipating the announcement of its inaugural commercial order batch by the fourth quarter of 2025.
SiCarrier engages with major Chinese foundries, including SMIC and Hua Hong Group, already having some etching equipment in operation for power semiconductor lines. Furthermore, the company has plans to extend its R&D centers to over ten cities within the next three years, alongside establishing service centers in Europe and Southeast Asia.
Launched in 2022, SiCarrier is backed by experienced personnel; its technology chief, Dai Jun, is also affiliated with China’s Big Fund II and serves on the board of SMIC. An earlier Bloomberg report indicated that SiCarrier collaborates with Huawei as a state-supported semiconductor equipment developer.
The South China Morning Post highlighted SiCarrier’s achievement of a patent for producing 5nm chips employing DUV tools, tied to Huawei’s 7nm chip featured in the Mate 60 Pro. According to Tom’s Hardware, despite not showcasing lithography equipment at SEMICON China, SiCarrier impressed attendees with a wide range of semiconductor manufacturing gear, including metrology and inspection systems, already manufacturing litho machines capable of 300-mm wafers at 28nm and older process nodes.
In summary, SiCarrier’s ambitious plans for the future underscore its commitment to advancing China’s semiconductor capabilities. With significant partnerships and a range of products in development, including ASML-compatible lithography machines, the firm’s trajectory could reshape the landscape of chip manufacturing. Their efforts to expand R&D and establish global service centers further highlight their strategic growth objectives.
Original Source: www.trendforce.com
